发明名称 |
FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEVICES |
摘要 |
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
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申请公布号 |
US2008148559(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20080042222 |
申请日期 |
2008.03.04 |
申请人 |
NICKERSON ROBERT M;SPREITZER RONALD L;CONNER JOHN C;TAGGART BRIAN |
发明人 |
NICKERSON ROBERT M.;SPREITZER RONALD L.;CONNER JOHN C.;TAGGART BRIAN |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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