| 摘要 |
The present invention relates to a semiconductor component (10), particularly for LIN bus systems, having an integrated circuit (12) whose top has a plurality of pads (20) for input and/or output of electrical signals; and also having a plurality of electrically conductive contact tabs (22, 42, 46), at least some of which are electrically connected to respectively associated pads (20) on the integrated circuit (12) by means of connection bonding wires (24); the invention provides for a screen bonding wire (28), which is arranged with both ends at a uniform electrical potential, particularly on one of the contact tabs (22, 42, 46), to be provided adjacent to a connection bonding wire (24). Use for electronic circuits. |
