| 摘要 |
A holder-wafer conjugate, including a wafer in a wafer holder, is tilted so that the planar wafer surface makes a small angle with a plane parallel to the liquid surface of a liquid bath. Then, the holder-wafer conjugate is moved downward and a leading edge of the holder-wafer conjugate makes initial contact with the liquid surface of a liquid bath at a slow piercing speed to minimize generation of shock waves and bubbles. After a small portion of the holder-wafer conjugate is immersed in the liquid bath at a first pause location, the downward movement is stopped for a first pause time. After the first pause time, downward movement of the holder-wafer conjugate is resumed at a faster post-piercing speed until the wafer is fully immersed.
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