发明名称 |
FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME |
摘要 |
A method for forming semiconductor packages is disclosed. The method involves providing a support substrate and forming at least one conductive layer thereon. The method also includes coupling the at least one conductive layer to a support face of a film substrate for securing the at least one conductive layer to the support face and removing the support substrate from the at least one conductive layer. The at least one interconnector is adhered to the film substrate for forming an interposer. The method further involves bonding a integrated circuit chip to the at least one conductive layer of the interposer and disposing a compound over the support face to thereby encapsulate the integrated circuit chip and the least one conductive layer for forming an encapsulated package therefrom. Portions of the at least one conductive layer is then exposed by removing the film substrate from the encapsulated package.
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申请公布号 |
US2008150107(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20080043143 |
申请日期 |
2008.03.06 |
申请人 |
ADVANPACK SOLUTION PTES LTD |
发明人 |
TAN TECK TIONG;CHEW HWEE SENG JIMMY;LIM KOK YEOW EDDY;CHICHIK ABD. RAZAK BIN;LAU KEE KWANG;WONG CHUAN WEI |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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