| 摘要 |
<P>PROBLEM TO BE SOLVED: To automatically correct dislocation when jointing a bump electrode of an electronic component to a corresponding terminal electrode of a substrate. <P>SOLUTION: An alignment projection 12 which is higher than a bump electrode 11 is formed at a semiconductor element. A recess 14 is formed to correspond to the alignment projection 12 on a substrate. The alignment projection 12 is firstly inserted into the recess 14 of the substrate to be deformed. An electronic component is moved sideways such that the bump electrode 11 approaches a wiring electrode 13 of the substrate, for automatic correction. <P>COPYRIGHT: (C)2008,JPO&INPIT |
