发明名称 |
Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
摘要 |
A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn<SUP>2+</SUP>-containing inorganic oxide material or a low liquidus temperature inorganic material.
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申请公布号 |
US2008149924(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20080072784 |
申请日期 |
2008.02.28 |
申请人 |
AITKEN BRUCE GARDINER;KOVAL SHARI ELIZABETH;QUESADA MARK ALEJANDRO |
发明人 |
AITKEN BRUCE GARDINER;KOVAL SHARI ELIZABETH;QUESADA MARK ALEJANDRO |
分类号 |
B05D1/40;B05D1/02;B05D1/18;B05D3/02;B05D3/12;B05D5/12;C23C14/28;C23C14/34;H01L51/40 |
主分类号 |
B05D1/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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