SYSTEMS AND METHODS FOR PRINTED CIRCUIT BOARD SUPPORT

摘要

A reflow oven for processing printed boards includes at least one lateral end support chain configured to support a printed circuit board along one of its lateral ends and a board support chain. The lateral end support chain and the board support chain are configured to help to convey the printed circuit board along at least a portion of the reflow oven. The board support chain is further configured with a multiple of board support positions with each board support position defined by a stopper finger and one or more support fingers. Each of the stopper and support fingers are disposed along each board support position in relation to one another and at locations such that, where the board support chain receives the printed circuit board, the stopper finger is disposed against or is substantially proximate to an edge of the printed circuit board and the one or more support fingers contact the printed circuit board at one or more discrete areas of a surface of the printed circuit board. The support fingers are removably connected to the board support chain in order the positions of the support fingers within a given board support position correlate to one or more of the discrete areas of the printed circuit board surface that the support fingers contact to thereby provide support to the board. The board support chain is preferably disposed within a reflow oven such that the board support chain supports a printed circuit board substantially centrally relative to the lateral ends of the printed circuit board. The board support chain thereby helps to reduce any risks associated with warping and/or sagging of a relatively wide or large printed circuit board during reflow processing.