| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a modular type sensor assembly and methods of fabricating the same. <P>SOLUTION: The modular sensor assembly (10) and the methods (70) of fabricating the modular sensor assembly (10) are provided. The modular sensor assembly (10) includes a sensor array (12), coupled to an electronics array (14) in a stacked type configuration. The sensor array (12) is provided with a plurality of sensor modules (22), each comprising a plurality of sensor subarrays (18). The electronics array (14) comprises a plurality of integrated circuit modules (24), each comprising a plurality of integrated circuit chips (20). The sensor modules (22) may at times be coupled to the electronics modules (24) via flip chip technology. <P>COPYRIGHT: (C)2008,JPO&INPIT |
