| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove dirt adhering to a capillary appropriately not only in the vibration direction of the capillary but also in a direction differing from the vibration direction in a wire bonding method joining a wire to a member to be joined by a ball bonding method. <P>SOLUTION: The wire bonding method has a cleaning process for scrapping off dirt by performing vibration in a fixed direction Y while the tip of the capillary 100 is being pressed against a cleaning member 200. Further, the cleaning process comprises: a first process to be performed in a state where the direction of the capillary 100 around the axis of the capillary 100 is at the same position as that when joining the wire 40; and a second process to be performed in a state where the capillary 100 is rotated around the axis of the capillary 100 so that the direction of the capillary 100 around the axis of the capillary 100 is at a position different from that of the first process. <P>COPYRIGHT: (C)2008,JPO&INPIT |
