发明名称 EBG STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an EBG structure capable of changing a frequency forming a band gap by changing an external environmental condition such as a temperature change. SOLUTION: The EBG structure comprises a substrate 1, a conductor 2 formed on the first surface of the substrate 1, a plurality of conductor patterns 3 formed on the second surface of the substrate 1 and arrayed with prescribed intervals, and a through-hole 4 electrically connecting the conductor 2 and the conductor patterns 3. The substrate for which the change amount (thermal expansion rate) of length by the temperature change is different in a thickness direction (Y axis direction) and a direction (X axis direction) parallel with the surface is used as the substrate 1, and the frequency generating the band gap is changed by imparting the temperature change. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008147763(A) 申请公布日期 2008.06.26
申请号 JP20060329538 申请日期 2006.12.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 IHATA KOUJI;MISU KOICHIRO;KIMURA TOMONORI
分类号 H01Q15/14;H01P1/00 主分类号 H01Q15/14
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