发明名称 |
Substrate holding apparatus |
摘要 |
The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body (2) for holding a substrate, an elastic pad brought into contact with the substrate, and a support member (6) for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member (8,9) has an elastic membrane brought into contact with the elastic pad. A first pressure chamber (24,25) is defined in the contact member, and a second pressure (22,23) chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source (120) for independently supplying a fluid into or creating a vacuum in the first pressure chamber (24,25) and the second pressure chamber (22,23). |
申请公布号 |
EP1935566(A2) |
申请公布日期 |
2008.06.25 |
申请号 |
EP20080007303 |
申请日期 |
2001.10.11 |
申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA, TETSUJI;NOJI, IKUTARO;NAMIKI, KEISUKE;YASUDA, HOZUMI;KOJIMA, SHUNICHIRO;SAKURAI, KUNIHIKO;TAKADA, NOBUYUKI;NABEYA, OSAMU;FUKUSHIMA, MAKOTO;TAKAYANAGI, HIDEKI |
分类号 |
B24B37/005;B24B37/04;B24B37/30;B24B41/06;H01L21/304 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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