发明名称 |
Integrated circuit including a temperature monitor element and thermal conducting layer |
摘要 |
In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.
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申请公布号 |
US7391092(B2) |
申请公布日期 |
2008.06.24 |
申请号 |
US20050088995 |
申请日期 |
2005.03.24 |
申请人 |
NEC ELECTRONICS CORPORATION;NEC CORPORATION |
发明人 |
OHKUBO HIROAKI;NAKASHIBA YASUTAKA;KAWAHARA NAOYOSHI;MURASE HIROSHI;ODA NAOKI;SASAKI TOKUHITO;ITO NOBUKAZU |
分类号 |
H01L23/52;H01L31/058;G01K7/16;H01L21/3205;H01L21/822;H01L23/34;H01L23/522;H01L23/58;H01L27/00;H01L27/04 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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