发明名称 Integrated circuit including a temperature monitor element and thermal conducting layer
摘要 In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.
申请公布号 US7391092(B2) 申请公布日期 2008.06.24
申请号 US20050088995 申请日期 2005.03.24
申请人 NEC ELECTRONICS CORPORATION;NEC CORPORATION 发明人 OHKUBO HIROAKI;NAKASHIBA YASUTAKA;KAWAHARA NAOYOSHI;MURASE HIROSHI;ODA NAOKI;SASAKI TOKUHITO;ITO NOBUKAZU
分类号 H01L23/52;H01L31/058;G01K7/16;H01L21/3205;H01L21/822;H01L23/34;H01L23/522;H01L23/58;H01L27/00;H01L27/04 主分类号 H01L23/52
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