发明名称 |
Method and composition for polishing a substrate |
摘要 |
Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an electrochemical mechanical polishing process. The polishing compositions used in barrier removal may further be used after a process for electrochemical mechanical planarization process of a conductive material. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization type defects.
|
申请公布号 |
US7390744(B2) |
申请公布日期 |
2008.06.24 |
申请号 |
US20050130032 |
申请日期 |
2005.05.16 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
JIA RENHE;LIU FENG Q.;TSAI STAN D.;CHEN LIANG-YUH |
分类号 |
H01L21/302;B23H5/08;C09G1/02;C09K13/00;C11D3/14;C11D3/39;C11D11/00;C25F3/02;C25F3/08;H01L21/321;H01L21/44;H01L21/4763;H01L21/768 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|