发明名称 |
Semiconductor apparatus configured with a lead frame having sufficient strenght to protect against external forces |
摘要 |
Disclosed is a semiconductor apparatus including: a first molded resin portion; a plate-shaped lead frame closely attached to the first molded resin portion; a second molded resin portion attached facing the first molded resin portion and the lead frame; and one or more elements attached on the lead frame on a side which faces the second molded resin portion, the one or more elements including a semiconductor element, wherein any part of at least one of the elements does not exist in a region composed of an aggregation of line segments, each line segment being formed by any two points on an outer periphery of the plate-shaped lead frame outside the first and second molded resin portions and all of the line segments being contained inside a board of the lead frame.
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申请公布号 |
US7391102(B2) |
申请公布日期 |
2008.06.24 |
申请号 |
US20040961409 |
申请日期 |
2004.10.12 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOMOTO SATOSHI;OKUDA HAJIME;TANAKA HIROKAZU |
分类号 |
H01L23/495;H01S5/022;H01L23/02;H01L23/06;H01L23/28;H01L23/29;H01L23/34;H01L23/52;H01L27/15;H01S5/0683 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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