| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent inclination of a clip lead due to difference in thickness of an electronic component constituting a semiconductor device, and to prevent horizontal movement of the clip lead. <P>SOLUTION: The semiconductor device includes a supporting plate (2) to which an electronic component (1) is bonded, a lead terminal (3) spaced apart from the support plate (2), and a clip lead (4) for connecting the upper surface electrode of the electronic component (1) and the lead terminal (3) electrically. One of the lead terminal (3) or the clip lead (4) is provided with vertical protrusions (3a, 4a), the other of the lead terminal (3) or the clip lead (4) is provided with a pair of guide members (4b, 3b) elongating in parallel with the protrusions (3a, 4a), and the vertical guide portion (5) of the clip lead (4) is formed by holding the protrusions (3a, 4a) slidably in the vertical direction in the pair of guide members (4b, 3b). Since the clip lead (4) slides vertically in correspondence with the thickness of the electronic component (1), inclination of the clip lead (4) due to difference in thickness of the electronic component (1) is prevented and horizontal movement of the clip lead (4) can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT |
