| 摘要 |
<P>PROBLEM TO BE SOLVED: To smoothly extract and insert a bonding tool from/into a chuck arranged in a bonding arm in a wire bonding device. <P>SOLUTION: The device is provided with a bonding tool extraction/insertion mechanism 31 which linearly moves a rotary turret 31c to which a plurality of holding parts 31a holding a capillary 16 are fitted to an axial direction of the chuck 18a by a linear driving part 31d and a chuck opening/closing mechanism 33 which linearly moves and rotates a wrench 33a opening and closing the chuck 18a to the axial direction of a wrench hole 18b. The bonding tool extraction/insertion mechanism 31 is raised and lowered in the axial direction of the chuck 18a in cooperation with a chuck opening/closing operation by the chuck opening/closing mechanism 33 so as to extract/insert the capillary 16 in a still state of the bonding arm 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
