发明名称 APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER
摘要 <p>An apparatus for precipitating/separating excess copper which has dissolved in a lead-free solder comprising tin as the main ingredient. With the apparatus, the tin is safely and efficiently recovered. The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper. It has a constitution comprising: a precipitation tank (2) in which a lead-free solder containing copper dissolving therein is kept in a molten state and an intermetallic compound among a metal added externally, the copper contained in the molten solder, and the tin contained in the molten solder is precipitated while maintaining the molten state; a granulation tank (4) which has perforated plates (31), (32), and (33) and in which the molten lead-free solder is passed through the perforated plates to thereby bond particles of the intermetallic compound to one another and increase the particle diameter thereof; and a separation tank (5) in which the enlarged intermetallic compound particles are sedimented in the molten lead-free solder and separated.</p>
申请公布号 WO2008072330(A1) 申请公布日期 2008.06.19
申请号 WO2006JP324949 申请日期 2006.12.14
申请人 NIHON SUPERIOR SHA CO., LTD.;NISHIMURA, TETSURO 发明人 NISHIMURA, TETSURO
分类号 C22B25/06;B23K3/08;C22B7/00;C22B9/10 主分类号 C22B25/06
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