| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a film carrier which assures the adhesiveness of mold resin when solder resist containing silicone defoaming agent is used. SOLUTION: The method for manufacturing a film carrier 1 includes the steps of applying photoresist to the front surface of a metal foil on insulating film 2; performing exposure/development; then etching and forming wiring pattern 5; and forming a solder resist layer 4 containing silicone system defoaming agent, with lead portion being left. With an inner lead 9 and outer leads 10a, 10b of the wiring pattern 5 being left, the solder resist layer 4 is formed on the front surface of the insulating film 2 from the wiring pattern 5; subsequently, the film carrier 1 is cleaned by alkali solution in order to remove silicone system defoaming agent existing on the front surface of the film carrier 1; and then an IC chip is mounted on the inner lead 9. Even though the silicone defoaming agent oozes on the surface of the film carrier, it is removed by alkali cleaning. Therefore, the mold resin can be secured firmly. COPYRIGHT: (C)2008,JPO&INPIT
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