| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer pressing structure of a wafer transfer container which hardly causes breakage or a storage defect even if an external force is applied. <P>SOLUTION: Between a pair of support frames 10 and 10 fixed to the reverse surface side 7a of a lid body 7, horizontal portions 11 and 11 which are horizontally extended almost in plane with a reverse surface 10a, have constant widths, and are laid to lengths so that they can elastically be deformed are provided so that the horizontal portions 11 and 11 are united. A plurality of semiconductor wafers 4, ..., stored in a container body 6 are held so as to abut on arcuate portions 14 and 14 which have movement suppressing projections 16 and 16 of wafer contact portions 9 and 9 and can elastically be deformed in downward convex shapes. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
