| 摘要 |
PROBLEM TO BE SOLVED: To reduce a DC resistance under the state mounted to a mounting substrate in an inductance part fitting a terminal onto the side face of an element assembly. SOLUTION: The inductance part has the element assembly 6, a coil 7 formed in the element assembly 6 and the terminals 8A and 8B electrically connected to the coil 7 while being formed to a part of at least the outer side face in the element assembly 6. Irregularities 9 are formed to the outer side faces in the terminals 8A and 8B. According to such a constitution, contact areas formed with a solder and the terminals 8A and 8B can be increased, thus allowing the reduction of the DC resistance. COPYRIGHT: (C)2008,JPO&INPIT
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