A semiconductor package is provided to reduce the size and number of bonding pads by bonding plural wires to one bonding pad. Plural bonding pads(11) are formed on a semiconductor chip(10). A conductive bump is formed on the bonding pad and has a first surface and a second surface. The second surface is lower than the first surface. A substrate(20) supports the semiconductor chip and includes plural leads(21). A first conductive wire(40) electrically connects the first surface of the conductive bump to the lead. A second conductive wire electrically connects the second surface of the conductive bump to the lead. The first conductive wire and the second conductive wire are connected to different leads. A step is formed by the first surface and the second surface of the conductive bump. An area of a lower portion forming the second surface is wider than that of an upper portion forming the first surface.
