| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lighting device which ensures a desired emission area, and improves the connection reliability of wire bonding between rows of electrode pads and semiconductor light-emitting elements connected to each other via bonding wires. <P>SOLUTION: A plurality of electrode pads 5 and a plurality of semiconductor light-emitting elements 11 are placed alternately in two-dimensional arrangement in the direction of extension of one side 2a of a board on an insulating layer 3 attached to the board. The pads 5 and the light-emitting elements 11 form rows L1 and L2, and an end electrode pad 7 at one end of each row is arranged at an interval F identical with an interval C between each light-emitting element 11 and each pad 5. The light-emitting elements 11, the pads 5, and the end electrode pad 7 are connected through in-row bonding wires 17. The end electrode pads 7 adjacent to each other in the direction of extension of other sides 2b and 2c of the board that are perpendicular to the one side 2a are connected through a row-connection bonding wire 19. The rows L1 and L2 are lined up in the direction of extension of the other sides 2b and 2c across a separation distance B that is greater than each of the intervals C and F between the emission elements 11, the pads 5, and the end electrode pad 7. A separation distance G between the end electrode pads 7 adjacent to each other in the direction of extension of the other sides 2b and 2c is determined to be identical with the interval C. <P>COPYRIGHT: (C)2008,JPO&INPIT |
