| 摘要 |
A method for slicing a plurality of wafers from a workpiece is provided to adjust the speed of an effective wire by embodying front and rear characteristics of wire transfer as a function of a table position. A workpiece fixed to the surface of a table passes through a wire gate formed by a sawing wire transferred at an effective speed and transfers at a variable front transfer speed by a relative transfer, vertically confronting the vertical axis of the workpiece between the table and the wire gate of the wire saw. The effective speed of the sawing wire is adjusted as a function of a front transfer speed and the cross section of the workpiece to make uniform the abrasion of the sawing wire. The effective speed of the sawing wire can be embodied by a function of the gearing length of the sawing wire with the inside of the workpiece.
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