发明名称 SCREEN PRINTING MACHINE AND BUMP FORMING METHOD
摘要 A screen printing machine and a bump forming method are provided to reduce a facility cost by configuring a plurality of soldering bumps at a high speed. A screen printing machine includes a sheave shape body(45), and a vibrator(47). The screen printing machine provides and prints a soldering ball using a printing unit by installing a mask on an electrode formed on a substrate. The sheave shape body has a metal plane having a plurality of apertures. The vibrator applies a vibration to the sheave shape body. The aperture is widened by vibrating the sheave shape body with the vibrator. A soldering ball received in the sheave shape body is provided to an electrode of the substrate by installing the mask.
申请公布号 KR20080055715(A) 申请公布日期 2008.06.19
申请号 KR20070130566 申请日期 2007.12.14
申请人 HITACHI PLANT TECHNOLOGIES, LTD. 发明人 MUKAI NORIAKI;HONMA MAKOTO;ABE ISAO
分类号 H05K3/40 主分类号 H05K3/40
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