发明名称 |
SCREEN PRINTING MACHINE AND BUMP FORMING METHOD |
摘要 |
A screen printing machine and a bump forming method are provided to reduce a facility cost by configuring a plurality of soldering bumps at a high speed. A screen printing machine includes a sheave shape body(45), and a vibrator(47). The screen printing machine provides and prints a soldering ball using a printing unit by installing a mask on an electrode formed on a substrate. The sheave shape body has a metal plane having a plurality of apertures. The vibrator applies a vibration to the sheave shape body. The aperture is widened by vibrating the sheave shape body with the vibrator. A soldering ball received in the sheave shape body is provided to an electrode of the substrate by installing the mask.
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申请公布号 |
KR20080055715(A) |
申请公布日期 |
2008.06.19 |
申请号 |
KR20070130566 |
申请日期 |
2007.12.14 |
申请人 |
HITACHI PLANT TECHNOLOGIES, LTD. |
发明人 |
MUKAI NORIAKI;HONMA MAKOTO;ABE ISAO |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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