| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of a thermoelectric conversion element, in which contact resistance in a bonding part is reduced and which is fitted to RoHS regulation without little secular deterioration in a bonding structure bonding a thermoelectric semiconductor element to an electrode electric circuit board through a conductive adhesive layer. SOLUTION: In the bonding structure of the thermoelectric semiconductor elements 2 and 3 and the electrode electric circuit board 6 in a thermoelectric conversion module where a plurality of n-type and p-type thermoelectric semiconductor elements are bonded in series, Cu thin film layers 4 and 4 are laminated on a bonding face of the thermoelectric semiconductor elements 2 and 3. The conductive adhesive layers 5 and 5 are laminated on the Cu thin film layers. The thermoelectric semiconductor elements are bonded to the electrode electric circuit board 6 through the conductive adhesive layers 5 and 5 in the bonding structure of the thermoelectric conversion element. COPYRIGHT: (C)2008,JPO&INPIT
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