| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor integrated circuit, where damage or stress to a power transistor is reduced by clarifying the route of current flowing to the power transistor and by optimizing current flowing to the power transistor. <P>SOLUTION: The semiconductor integrated circuit has: the power transistor 100A; a plurality of first buses 140-142 formed immediately above the power transistor 100A; a plurality of second buses 150-152; and a contact pad 304 provided in each of the plurality of first and second buses 140-142, 150-152. The plurality of first and second buses 140-142, 150-152 are formed so that the area becomes smaller successively from the buses positioned at a side near an external connection member 307 to those positioned at a distance. <P>COPYRIGHT: (C)2008,JPO&INPIT |
