| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enable homogeneous formation of a plated film by electroless plating, suppression of a damage to a wafer substrate 13, and batch processing of the plating and operations after and before the plating. <P>SOLUTION: A substrate processing apparatus comprises a cassette case 100 in which wafer substrates 13 are supported by a plurality of support jigs 12 arranged at the peripheries of the wafer substrates 13 and the wafer substrates 13 supported by the support jigs 12 are rotated about a rotary shaft 16 in a plating solution. Ends of the support jigs 12 are fitted in slits 11a, 11b formed in the outer peripheries of discs 10a, 10b of the cassette case 100 to parallelly support the plurality of wafer substrates 13 in grooves 12a formed in the support jigs 12. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
