发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition being balanced between mold transcription properties, mechanical characteristics such as rigidity and good flowability in a high level. SOLUTION: The polyamide resin composition comprises 100 pts.wt. of a polyamide resin (a), 10-200 pts.wt. of a fibrous inorganic filler (b) and 0.01-30 pts.wt. of a resinous polyester resin (c) comprising at least one species structural unit selected from aromatic oxycarbonyl units (S), aromatic and/or aliphatic dioxy units (T) and aromatic dicarboxy units (U), and ≥3-functional organic residues (D) whose content is in the range of 7.5-50 mol% based on the entire monomers constituting the resinous polyester. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008133429(A) 申请公布日期 2008.06.12
申请号 JP20070195747 申请日期 2007.07.27
申请人 TORAY IND INC 发明人 HAMAGUCHI MITSUSHIGE;YOKOE MAKIHITO
分类号 C08L77/00;C08K7/04 主分类号 C08L77/00
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