发明名称 |
Non-invasive thermal management processes for restorating metallic details bonded to substrates |
摘要 |
A thermal management process for enabling the restoration of a surface of a metallic detail in the presence of at least one bonding material, comprising preparing at least one damaged area on a metallic detail; disposing at least one thermal management component upon a bonding material or a surface area proximate to the bonding material to which the metallic detail is joined; masking at least the surface area and the bonding material with a masking agent; and dimensionally restoring a surface of the metallic detail disposed on the article at a processing temperature lower than a temperature which would degrade the bonding material, the substrate, or the bondment interface therebetween.
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申请公布号 |
US2008138511(A1) |
申请公布日期 |
2008.06.12 |
申请号 |
US20060637296 |
申请日期 |
2006.12.12 |
申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
BOGUE WILLIAM;ROBERTSON JOHN M.;SHUBERT GARY |
分类号 |
B23P6/00;B05D1/00;B23K31/02;C23C4/00;C23C16/00 |
主分类号 |
B23P6/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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