摘要 |
<p>Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.</p> |
申请人 |
APPLIED MATERIALS, INC.;LOPATIN, SERGEY;DUKOVIC, JOHN O.;EAGLESHAM, DAVID;KOVARSKY, NICOLAY Y.;BACHRACH, ROBERT;BUSCH, JOHN;GAY, CHARLES |
发明人 |
LOPATIN, SERGEY;DUKOVIC, JOHN O.;EAGLESHAM, DAVID;KOVARSKY, NICOLAY Y.;BACHRACH, ROBERT;BUSCH, JOHN;GAY, CHARLES |