ELECTRONIC COMPONENT TESTING METHOD AND ELECTRONIC COMPONENT TESTING EQUIPMENT

摘要

In an electronic component testing method, a test tray mounting an IC device before test is carried into a test chamber (120), the IC device mounted on the test tray is pressed against a socket (52) provided on a high fix (51) attached to the upper portion of a test head (5), the input/output terminal of the IC device is touched electrically to the socket (52) in order to test the IC device and the tested IC device is carried out from the test chamber (120) while being mounted on the test tray. The IC device before test is mounted during approaching/receding operation or during test of the IC device and a test tray (TST<SUB>n-1</SUB>) which is carried in to oppose the high fix (51) next is carried substantially in parallel with the major surface of the test tray (TST<SUB>n-1</SUB>).