VERFAHREN ZUR GEHÄUSEBILDUNG BEI ELEKTRONISCHEN BAUTEILEN SO WIE SO HERMETISCH VERKAPSELTE ELEKTRONISCHE BAUTEILE

摘要

A process to encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C. is provided. The process forms a housing for electronic modules, in particular sensors, integrated circuits and optoelectronic components. The process includes the steps of: providing a substrate, of which at least a first substrate side is to be encapsulated; providing a vapor-deposition glass source; arranging the first substrate side in such a manner with respect to the vapor-deposition glass source that the first substrate side can be vapor-coated; and vapor-coating the first substrate side with a glass layer.