| 摘要 |
A semiconductor device is disclosed, which includes first, second and third power supply pads arranged in a peripheral area of a semiconductor chip, the second pad applied with a higher potential than the first pad, and the third pad applied with a higher potential than the second pad, first, second and third power supply wirings arranged in the peripheral area, the first wiring connected to the first pad, the second wiring connected to the second pad, and the third wiring connected to the third pad, a plurality of first electrostatic protection circuits arranged in the peripheral area and connected between the first and second wirings in correspondence to the first, second and third pads, and a plurality of second electrostatic protection circuits arranged in the peripheral area and connected between the second and third wirings in correspondence to the first, second and third pads.
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