Method for soldering miniaturised components to a base plate

摘要

The invention relates to a process for fastening a miniaturized component (2) having a wettable bottom side (4) on a base plate (1) by a solder joint, wherein the base plate (1) is coated on one side with a continuous layer of metal (5), a soldering material (6) is placed on the coated side of the base plate (1), the component (2) is arranged above the soldering material (6), the soldering material (6) and the bottom side (4) of the component (2) facing the base plate (1) being a vertical distance apart and not in contact with one another, and a laser beam is supplied from the opposite side of the coated side of the base plate (1) for melting the soldering material (6), after which a contact between the bottom side (4) of the component (2) and the melted soldering material (6) is made for mutual fastening. Either the not melted soldering material (6) forms a flat lump, before the laser beam is supplied, which upon melting becomes a drop with the result that the drop of soldering material (6) fills the space between the bottom side (4) of the component (2) and the base plate (1) and wets the surface of the bottom side (4) of the component (2) or the soldering material (6) forms a continuous spot of a multiple area than the surface of the bottom side (4) of the component (2) and after melting of a circumscribed part of said spot facing the bottom side (4) of the component (2), the component (2) is dipped into the melted soldering material (6), wetting the surface of the bottom side (4) of the component (2), whereupon the component (2) is lifted back to its previous determined position the soldering material (6) bonding to the surface of the bottom side (4) of the component (2).