发明名称 Plasma Processing Apparatus
摘要 A dry etching apparatus comprises: a vacuum chamber where a processing target is disposed on a bottom wall side of an internal space; a coil for generating plasma that is disposed above and outside the vacuum chamber and has conductors disposed so that a gap is formed in a plane view; a top wall that closes the top of the internal space and has a transparent section at a position corresponding to the gap between conductors of the coil 36 in the plane view; and a camera that is disposed above the coil and can capture at least a part of the processing target in a field of view through the gap and the transparent section. The status of the processing target during plasma processing can be observed in real-time.
申请公布号 US2008138993(A1) 申请公布日期 2008.06.12
申请号 US20050794306 申请日期 2005.12.06
申请人 HIROSHIMA MITSURU;MIYAKE SUMIO;OKUNE MITSUHIRO;WATANABE SHOZOH;SUZUKI HIROYUKI 发明人 HIROSHIMA MITSURU;MIYAKE SUMIO;OKUNE MITSUHIRO;WATANABE SHOZOH;SUZUKI HIROYUKI
分类号 H01L21/3065 主分类号 H01L21/3065
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