发明名称 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA
摘要 A solid-state image pickup device, a method for manufacturing the same and a camera are provided to easily manufacture the device by forming a passivation film on a pad electrode using high-refractive index substance. Photodiodes(PD) are disposed in pixel regions serving as a light-receiving surface of a semiconductor substrate, and are partitioned on a pixel basis. Signal transferring portions are disposed on the semiconductor substrate to read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges. Insulating films(15-17,20-22,25-27,30,31,33) are disposed on the semiconductor substrate to cover the photodiodes. Concave portions(H) are formed in the insulating films above the photodiodes. Pad electrodes(32) are disposed on the insulating films in pad electrode regions. A passivation film(36) of high refractive index covers inner walls of the concave portions. An embedded layer(37) of a high refractive index is filled in the concave portions.
申请公布号 KR20080053193(A) 申请公布日期 2008.06.12
申请号 KR20070123033 申请日期 2007.11.29
申请人 SONY CORPORATION 发明人 TOUMIYA YOSHINORI;TATANI KEIJI;AJISAWA HARUHIKO;INOUE YUJI;IWASHITA TETSUHIRO;KATO HIDEAKI
分类号 H01L27/146;H01L27/14 主分类号 H01L27/146
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