PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

Disclosed is a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated group, and (C) a photopolymerization initiator. The component (B) of this photosensitive resin composition contains a specific bisphenol A (meth)acrylate compound, a specific alkoxylated trimethylolpropane tri(meth)acrylate compound, and a specific nonylphenyl polyalkyleneglycol (meth)acrylate compound. Also disclosed are a photosensitive element using such a photosensitive resin composition and a method for manufacturing a printed wiring board.