PHOTOSENSITIVE RESIN COMPOSITION TO BE USED FOR MANUFACTURING PRINTEED WIRING BOARD

摘要

A method for manufacturing a printed wiring board for reducting the size and increasing the density the wiring board, simplifying the process, and improving connection reliability and yield of the mounted components, and a photosensitive resin composition to be used for the printed wiring board. The method for manufacturing the printed wiring board is characterized by sequentially carrying out (i) the step of forming a solder resist over a circuit wiring board; (ii) the step of overlaying the solder resist with a premolded photosensitive resin composition; (iii) the step of exposing and developing the photosensitive resin composition layer to form a resist pattern of the photosensitive resin composition; (iv) the step of electroless-plating the whole surfaces of them; and (v) the step of separating the layer of the photosensitive resin composition. A photosensitive resin composition to be used for the printed wiring board and a layer of this resin composition are also disclosed.