发明名称 |
DRIVING CHIP PACKAGE AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME |
摘要 |
A driving chip package and a liquid crystal display including the same are provided to reduce the size of a data driving chip package and a printed circuit board so as to decrease a manufacturing cost. A driving chip package(100) includes a base film(110), an inner lead, an outer lead, a wiring pattern(120), and at least one of signal transmitting wiring(130). The base film is made of insulation material and has a thickness ranging from 20mum to 100mum. The inner lead is formed on the base film. A driving chip is placed in the inner lead. The outer lead is formed on one side of the base film and contact to the outside. The wiring pattern is formed on the base film and connects between the inner lead and the outer lead. The wiring pattern has an input wiring and an output wiring. The signal transmitting wiring is formed on the base film and does not connect to the driving chip. |
申请公布号 |
KR20080051635(A) |
申请公布日期 |
2008.06.11 |
申请号 |
KR20060123107 |
申请日期 |
2006.12.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, IN YONG;SON, SUN KYU;LIM, MYONG BIN;LEE, JAE HAN;KIM, OCK JIN |
分类号 |
G02F1/1345 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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