发明名称 |
Method of forming low capacitance ESD robust diodes |
摘要 |
A method of forming a diode having a capacitance below 0.1 pF and a breakdown voltage of at least 500V. The method including forming an anode of a first conductivity type and a cathode of a second conductivity type disposed below the anode. At least one of the cathode and anode have multiple, vertically abutting diffusion regions. Forming isolation regions such that the cathode and anode are disposed between and bounded by adjacent isolation regions.
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申请公布号 |
US7384854(B2) |
申请公布日期 |
2008.06.10 |
申请号 |
US20020683985 |
申请日期 |
2002.03.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
VOLDMAN STEVEN H. |
分类号 |
H01L21/20;H01L21/76;H01L21/329;H01L21/62;H01L21/822;H01L23/62;H01L27/02;H01L27/04;H01L29/00;H01L29/861 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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