| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a proper configuration in which a plurality of chips that runs at a different power supply voltage can be mounted. SOLUTION: The semiconductor device 1 includes: octagon-shaped chips 2A to 2I that are arranged in a plane; and power supply chips 3A-3D that are placed between the octagon-shaped chips. COPYRIGHT: (C)2008,JPO&INPIT
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