| 摘要 |
<p>A discretionary number of semiconductor wafers are flexibly supported on both upper and lower sides. A thin board holding container is provided for holding a plurality of semiconductor wafers to transfer, store and process them. The container is provided with a plurality of process trays stacked in a status where the process tray separately holds at least one semiconductor wafer; and a combining mechanism which integrally combines the process trays in a status where a plurality of process trays are stacked and divides them at discretionary positions. One side of the process tray is provided with a fixing holding section of one side, which holds at least one semiconductor wafer on one side, and the other side of the process tray is provided with a fixing holding section of the other side, which forms a storage space for fixing and holding the thin board by isolating the thin board from external environment by fitting in each other with the fixing holding section of the other side of other process tray. Thus, the process trays of the number in accordance with the number of the semiconductor wafers are stacked and the thin board holding container is constituted.</p> |
