| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive tape capable of manufacturing a semiconductor device so that a series of manufacturing processes or processes for peeling the adhered tape is smoothly carried out, while allowing the adhered tape to suitably preventing resin from leaking during an encapsulation process. <P>SOLUTION: This heat-resistant adhesive tape for manufacturing the semiconductor device is for use in a method for manufacturing the semiconductor device which includes at least a process of mounting a semiconductor chip on a die pad of a metal lead frame bonded with the heat-resistant adhesive tape at an outer pad side, and a process of sealing the single face of the semiconductor chip side by using a sealing resin, and a process of dicing a sealed structure to individual semiconductor devices. Furthermore, the heat-resistant adhesive tape includes a substrate layer, and an adhesive layer containing hydrophilic layered silicate and an adhesive. <P>COPYRIGHT: (C)2008,JPO&INPIT |
