| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a stable and reliable flip-chip bonding by using a mounting structure which can prevent poor bonding from occurring even if the lead-free solder of a high melting temperature is used. <P>SOLUTION: The mounting structure is used in such a way that two base boards 1 and 2 each having juxtaposed electrodes face each other and sets of the electrodes are bonded to each other. Cylindrical electrodes 11 each having a recess 12 are formed on base board electrodes 10 of one of the base boards, and projecting electrodes 21 each having a projection 22 which fits in the depression portion 12 of the cylindrical electrode 11 are formed on base board electrodes 20 of the other base board. The projections 22 are bonded by soldering in the recesses 12 to which the projections 22 fit, and a space between the two base boards 1 and 2 is sealed with under-fill resin 7. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
