发明名称 Support body for semiconductor element, method for manufacturing the same and semiconductor device
摘要 A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess side wall is covered by a resin, thereby providing a light emitting device.
申请公布号 US2008128894(A1) 申请公布日期 2008.06.05
申请号 US20070976849 申请日期 2007.10.29
申请人 SAKANO KENSHO 发明人 SAKANO KENSHO
分类号 H01L23/04;H01L21/48;H01L23/02;H01L23/08;H01L23/498;H01L33/32;H01L33/50;H01L33/56;H01L33/60;H05K3/34 主分类号 H01L23/04
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