发明名称 MULTIPLE PATTERNING CERAMIC SUBSTRATE, AND CERAMIC WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multiple patterning ceramic substrate and a ceramic wiring substrate, which ensure providing brazing materials in given positions regardless of the sizes etc. of pads for brazing, allowing skip of conventional setting procedures, and to provide a method of manufacturing the substrate. <P>SOLUTION: The multiple patterning ceramic substrate 1 includes: a plurality of ceramic wiring substrates 10n each provided with a pad for brazing 14 and pads 15, 16 other than the pad for brazing 14; first external electrodes 5 and second external electrodes 6 formed in edge regions m lying outside a board region a where the plurality of ceramic wiring substrates 10n are two-dimensionally laid side-by-side; first plated wirings 7, 17 which connect the pads for brazing 14 and the first external electrodes 5; and second plated wirings 8, 18,19 which connect the pads 15, 16 other than the pad for brazing 14 and the second external electrodes 6. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008130946(A) 申请公布日期 2008.06.05
申请号 JP20060316440 申请日期 2006.11.24
申请人 NGK SPARK PLUG CO LTD 发明人 NAGAI MAKOTO;HATTORI TERUYOSHI;TANIMORI KENGO
分类号 H05K1/02;H01L23/12;H01L23/13;H05K3/00;H05K3/46 主分类号 H05K1/02
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