| 发明名称 |
Epoxy resin composition and semiconductor package including the same |
| 摘要 |
An epoxy resin composition includes an epoxy resin, a curing agent, a coupling agent, and an inorganic filler. The coupling agent may include a hydrocarbon-substituted siloxane resin having at least one terminal hydroxy group.
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| 申请公布号 |
US2008131702(A1) |
申请公布日期 |
2008.06.05 |
| 申请号 |
US20070984933 |
申请日期 |
2007.11.26 |
| 申请人 |
BAE KYOUNG CHUL;KIM JIN A;PARK YOON KOK |
发明人 |
BAE KYOUNG CHUL;KIM JIN A.;PARK YOON KOK |
| 分类号 |
C08G59/14;B32B27/06;H01L21/00 |
主分类号 |
C08G59/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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