PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a high-density printed circuit board and its manufacturing method which allow the high-density printed circuit board to be manufactured by reducing land forming areas, and connection reliability to be enhanced, by increasing the contact area between a land and a paste bump.

SOLUTION: This manufacturing method of the printed circuit board comprises the steps of forming a circuit pattern which includes the land on one side of a first substrate; forming the paste bump on the land on the first substrate; and laminating an insulating material on the one side of the first substrate so that the paste bump penetrates the insulating material, wherein the paste bump is formed so as to cover the land of the first substrate.

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