SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure which retains deformation small in the region between a semiconductor chip and a stiffener in a multilayer circuit wiring board which is constituted by laminating through an adhesion layer a plurality of insulating films having a conductive layer.

SOLUTION: A BGA type semiconductor device includes a square multilayer circuit wiring board which is constituted by laminating a plurality of insulating films having a conductive wiring layer, a square semiconductor chip mounted in the center of the one side of the multilayer circuit wiring board, and a frame-shaped stiffener of the width Lsw whose contour is same as the multilayer circuit wiring board, adhered to the surface where the semiconductor chip of the multilayer circuit wiring board is mounted, wherein the distance d between the one side of the semiconductor chip and the interior side of the stiffener is made larger than dminsettled by the length Lc of the one side of the semiconductor chip and the thermal expansion coefficient αc, and the thermal expansion coefficient αs of the stiffener, the yield distortion εyieldof the material composing the conductive layer, and the change amount ΔT of temperature.

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