发明名称 |
System und Verfahren zur Erzeugung von Hochspannungswiderstandsfähigkeit zwischen den nachgiebigen Stiften eines Steckverbinders mit hoher Kontaktdichte |
摘要 |
A system and method for providing high voltage resistance capability in a receptacle apparatus for accepting a high-density compliant pin connector. A plurality of high-density compliant pin through-holes are formed in a printed circuit board for receiving the pins of the high-density compliant pin connector. The through-holes are plated using an electrically conductive material, whereby conductive pads are formed around the plated through-holes on at least one side of the printed circuit board. Thereafter, the conductive pads around the plated through-holes on the printed circuit board are removed by controlled depth back-drilling so as to increase the inter-pad clearance of the through-holes for withstanding foreign voltages. <IMAGE> <IMAGE> |
申请公布号 |
DE60130412(T2) |
申请公布日期 |
2008.06.05 |
申请号 |
DE2001630412T |
申请日期 |
2001.07.11 |
申请人 |
ALCATEL USA SOURCING, L.P. |
发明人 |
SKEOCH, STEVEN |
分类号 |
H05K1/02;H01R12/70;H01R13/05;H05K1/11;H05K3/30;H05K3/34;H05K3/42 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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